A B O U T   T H E   W O R K S H O P

The objective of this workshop is to educate the participants into the key aspects of DCA. Firstly the workshop will cover and provide an understanding of the selection criterion and considerations for bare dies, their quality and acquisition considerations. The standards governing this area will be reviewed in terms of impacts to both manufacturers and producers. The second part of the workshop will deal with the two aspects of DCA namely Flip Chip (FC) and Chip-On-Board (COB). Both attachment technologies will be dealt with in terms of positioning, design guidelines and attachment considerations, usage, equipment, process development and analysis with real life examples

MODULE 1 – DIRECT CHIP ATTACHMENT

Overview
Pro’s & Con’s
Applications
Cost Factors
Foot Print Efficiency
Flip Chip Vs. Chip-On-Board

MODULE 2 – BARE DIES

Selection
Quality Considerations
Known Good Die (KGD) & Unknown Bad Die (UBD)
Procurement Standards
Road Map

MODULE 3 – FLIP CHIP DESIGN RULES

Bump Pitches
Bump Heights
Edge Clearance
Array Vs. Peripherals
Types of Under Bump Metallization (UBMs)
UBM Parameters
Bumping Processes
Bump Shear Strengths

MODULE 4 – FLIP CHIP ATTACHMENT

Merging with SMT Process
Process Flow Options
Understanding Underfills
Underfilling Trends
Developing & Qualifying The Process
Reworking Flip Chip

MODULE 5 – RELIABILITY & ANALYSIS

Reliability Factors
Failure Mechanisms & Modes
Electromigration
Micro-sectioning – How To’s
Analyzing Failures

MODULE 6 – CHIP-ON-BOARD

Applications
Positioning
Design Rules – Pad Design & Layout
Design Examples

MODULE 7 – ATTACHMENT

Bonding Process
Ball Bonding Vs. Wedge
Tools & Equipment
Bonding Variables
Merging COB In SMT
Process Flow Options
Pro’s & Con’s
Reworking Chip-On-Board

MODULE 8 – CONCLUSION

Summary of Key DCA Success Factors
Future Reading
Information Resources
References