____________________________________WORKSHOP 1 26 & 27 June 2007 SWISSOTEL THE STAMFORD, SINGAPORE
WORKSHOP OVERVIEW The SMT field is being challenged by highly advanced and demanding assembly techniques. A new wave of packaging has gained critical mass in the last several years and is positioned to eventually overtake many traditional SMT packages. While the migration is strongly on its way, in the interim both new and mainstream assembly must co-exist. The objective of this workshop is to provide a comprehensive coverage of advanced assembly techniques. It is designed for the SMT professionals to deal with both today’s needs and emerging leading edge demands. It provides in-depth knowledge on control and management of process yield, merging DCA into mainstream SMT and Tools and Techniques for Analysis and Development with a focus on Array Devices.
A B O U T T H E W O R K S H O P
Through this workshop the participants will learn about the latest trends in packages, grasp the complex interaction between variables and how to control and manage them for a successful process. The course focuses on small form factor, miniaturization and advanced packages assembly and control. Participants also learn how to deal with process issues, from mainstream assembly to many of the new devices and attachment methods. The workshop will also cover BGA assembly with focus on the variables that impact their assembly onto the PCB including an understanding of the collapse mechanism, joint formation requirements and metallurgical interactions taking place considering the vast variety of materials and metallization encountered. The program also aims to provide a grasp of the attachment variables, assembly requirements, assembly variants such as mirror image assembly and the process issues that may be encountered and how to correct them. Understanding of proper set-up, profiling and rework methodologies, imaging techniques, selection of the rework equipment, rework set-up, developing the rework profile and refining the rework process will also be covered. Emphasis will be placed on the impacts of Lead Free and, for the interim, mixed Sn/Pb and Lead Free process issues.
This workshop will comprise a 2-day intensive training on SMT concepts, processes, Advanced Package Attachment covering all aspects of BGAs, Micro BGAs and Bumped Array CSPs families, their advantages, features, assembly of the device on the PCB and Rework Processes. Regardless of the style and form factor, once the underlying principles are understood, BGA assembly can be approached in a comprehensive manner. This program will dispel many of the realities in dealing with BGA assembly and provide an insight on realistic and practically oriented expectations during the assembly steps. One of the key elements of the program is coverage of Non-Destructive Imaging techniques and their interpretation. A detailed analysis of many process issues, steps, practical and analytical techniques for the hands-on person who is involved in developing the process, specifying equipment and improving yields will be provided. At the end of this program the participants will acquire an excellent understanding and confidence to address BGAs and Array device yield issues, reduce assembly defects, acquire troubleshooting skills as well as improve their ability to develop processes involving emerging technologies and Lead Free soldering.
MODULE 1 – SMT DIRECTIONS Introduction to New Packages Product & Process Driving Factors From Mainstream to DCA & Everything In-Between Yield & Process Capability Needs MODULE 2 – PROCESS CONSIDERATIONS Interactive Variables Dealing With Small Form Factor Devices Solder Volume For Odd Form Devices Solder Volume Calculations for BGAs Solder Paste Release Pad Design & Layout Practical Tips, Guidelines and Control MODULE 3 – REFLOW ENGINEERING High Yield Considerations Understanding & Managing Heat Transfer Thermal Profiling Considerations Reflow Process Window Profiling for BGAs LF Impact on Moisture Sensitivity of Devices - IPC/Jedec Std. MODULE 4 – SOLDERING METALLURGY Types of Alloys Equilibrium Phase Diagrams Intermetallic Compounds Gold, Silver, Tin & Nickel Films Considerations Understanding ‘Black Pad’ Phenomenon MODULE 5 – ADDRESSING SOLDERING ISSUES Solder Balling Bridging & Opens Non-Wetting Solder Migration Voids Low Shear Strength Failures Fillet Lifting Tin Whiskers Solder Balls on Gold Fingers Real Life Examples of Reflow Process Trouble-shooting
MODULE 1 – SMT DIRECTIONS Introduction to New Packages Product & Process Driving Factors From Mainstream to DCA & Everything In-Between Yield & Process Capability Needs
MODULE 2 – PROCESS CONSIDERATIONS Interactive Variables Dealing With Small Form Factor Devices Solder Volume For Odd Form Devices Solder Volume Calculations for BGAs Solder Paste Release Pad Design & Layout Practical Tips, Guidelines and Control
MODULE 3 – REFLOW ENGINEERING High Yield Considerations Understanding & Managing Heat Transfer Thermal Profiling Considerations Reflow Process Window Profiling for BGAs LF Impact on Moisture Sensitivity of Devices - IPC/Jedec Std.
MODULE 4 – SOLDERING METALLURGY Types of Alloys Equilibrium Phase Diagrams Intermetallic Compounds Gold, Silver, Tin & Nickel Films Considerations Understanding ‘Black Pad’ Phenomenon
MODULE 5 – ADDRESSING SOLDERING ISSUES Solder Balling Bridging & Opens Non-Wetting Solder Migration Voids Low Shear Strength Failures Fillet Lifting Tin Whiskers Solder Balls on Gold Fingers Real Life Examples of Reflow Process Trouble-shooting
MODULE 6 – ANALYTICAL TOOLS & TECHNIQUES Equipment Classification, Types & Principle Function Microscopy & Imaging – SEM, SAM, RI Surface & Metallization – Scanning Probe, AFM, MI Materials Behavior – TMA, MI, DSC Contamination Analysis – FTIR Analytical Equipment – SMT Application Chart MODULE 7 – BGAs & ARRAY CSPs ASSEMBLY CONSIDERATIONS Merging Into Mainstream SMT Processes Optional Process Flows Key Process Control Points Metallization Considerations Metallurgy Interactions Lead Free Impacts Mixed Sn/Pb & LF impacts (Forward and Backward Compatibility Issues) Mirror Image Assembly Reliability Understanding and addressing BGA / CSP Issues - Voids, Bridging, Stretching, Opens, Delamination, Marginal Joints, Warpage related effects - Real Life Examples of BGA Process Issue MODULE 8 – IMAGING TECHNIQUES 2-D Vs. 3-D X-Ray Tomography & Laminography Optical Probes & Endoscopy Interpreting Images & Correlation AOI and AXI MODULE 9 – IMPROVING REWORK YIELDS Defining Rework Strategy & Approach Selection of Equipment & Pre-requisites Developing the Rework ‘Recipe’ Developing the Profile Optimum Practices For Removal & Reinstall Helpful Practical Tips - Do’s & Don’ts MODULE 10 – CONCLUSION / SUMMARY Listing of Applicable Standards Solder Volume Calculation Spread Sheet Printing Audit Guide
MODULE 6 – ANALYTICAL TOOLS & TECHNIQUES Equipment Classification, Types & Principle Function Microscopy & Imaging – SEM, SAM, RI Surface & Metallization – Scanning Probe, AFM, MI Materials Behavior – TMA, MI, DSC Contamination Analysis – FTIR Analytical Equipment – SMT Application Chart
MODULE 7 – BGAs & ARRAY CSPs ASSEMBLY CONSIDERATIONS Merging Into Mainstream SMT Processes Optional Process Flows Key Process Control Points Metallization Considerations Metallurgy Interactions Lead Free Impacts Mixed Sn/Pb & LF impacts (Forward and Backward Compatibility Issues) Mirror Image Assembly Reliability Understanding and addressing BGA / CSP Issues - Voids, Bridging, Stretching, Opens, Delamination, Marginal Joints, Warpage related effects - Real Life Examples of BGA Process Issue
MODULE 8 – IMAGING TECHNIQUES 2-D Vs. 3-D X-Ray Tomography & Laminography Optical Probes & Endoscopy Interpreting Images & Correlation AOI and AXI
MODULE 9 – IMPROVING REWORK YIELDS Defining Rework Strategy & Approach Selection of Equipment & Pre-requisites Developing the Rework ‘Recipe’ Developing the Profile Optimum Practices For Removal & Reinstall Helpful Practical Tips - Do’s & Don’ts
MODULE 10 – CONCLUSION / SUMMARY Listing of Applicable Standards Solder Volume Calculation Spread Sheet Printing Audit Guide
This is a high level program and requires a pre-understanding of SMT concepts. The program is meant for the Advanced Level SMT professional who wants to grasp the science of BGA and Array CSP Assembly and must manage the transition to Lead Free. The target audience would comprise Engineering Level personnel from Manufacturing, Assembly, Equipment, Maintenance and Failure Analysis disciplines. The target audience can also include experienced Technicians or Supervisory Levels with adequate grasp of SMT concepts. The program will also benefit related functions such as Vendor Quality or Incoming Quality responsible for materials and vendor development..
